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Volumn 14, Issue 2, 2004, Pages 107-110

Load bearing capacity of connections in tempered glass structures

Author keywords

[No Author keywords available]

Indexed keywords

BRITTLENESS; COMPACTION; COMPUTER SIMULATION; CRACK PROPAGATION; FINITE ELEMENT METHOD; LOADS (FORCES); MATHEMATICAL MODELS; RESIDUAL STRESSES; STIFFNESS; STRENGTH OF MATERIALS; STRUCTURAL DESIGN;

EID: 3142747760     PISSN: 10168664     EISSN: None     Source Type: Journal    
DOI: 10.2749/101686604777964116     Document Type: Article
Times cited : (9)

References (10)
  • 1
    • 0032664913 scopus 로고    scopus 로고
    • Load bearing capacity of tempered structural glass
    • CARRE H., DAUDEVILLE L., Load bearing capacity of tempered structural glass, ASCE Journal of Engineering Mechanics, vol. 125, n°8, 1999, p. 914-921.
    • (1999) ASCE Journal of Engineering Mechanics , vol.125 , Issue.8 , pp. 914-921
    • Carre, H.1    Daudeville, L.2
  • 3
    • 0015143370 scopus 로고
    • A model of structural relaxation in Glass
    • NARAYANASWAMY O.S., A model of structural relaxation in Glass, Journal of American Ceramic Society, vol. 54, n°10, 1971, p. 491-498.
    • (1971) Journal of American Ceramic Society , vol.54 , Issue.10 , pp. 491-498
    • Narayanaswamy, O.S.1
  • 5
    • 84995182345 scopus 로고
    • Relation between inelastic deformability and thermal expansion of glass in its annealing range
    • TOOL A.Q., Relation between inelastic deformability and thermal expansion of glass in its annealing range, Journal of the American Ceramic Society, vol. 29, n°9,1946, p. 240-253.
    • (1946) Journal of the American Ceramic Society , vol.29 , Issue.9 , pp. 240-253
    • Tool, A.Q.1
  • 6
    • 3142779207 scopus 로고
    • Influence of composition upon the apparent conductivity and emissivity of glass as a function of thickness and temperature
    • edited by Cremers and Fine, Plenum Press, New York USA
    • BANNER D., KLARSFELD S., Influence of composition upon the apparent conductivity and emissivity of glass as a function of thickness and temperature, Thermal conductivity 21, edited by Cremers and Fine, Plenum Press, New York USA (1990).
    • (1990) Thermal Conductivity , vol.21
    • Banner, D.1    Klarsfeld, S.2
  • 7
    • 3142715966 scopus 로고    scopus 로고
    • Finite element computation of residual stresses near holes in tempered glass plates
    • BERNARD F., GY R., DAUDEVILLE L., Finite element computation of residual stresses near holes in tempered glass plates, Glass Technology, vol. 43C, 2002, p. 290-295
    • (2002) Glass Technology , vol.43 C , pp. 290-295
    • Bernard, F.1    Gy, R.2    Daudeville, L.3
  • 8
    • 3142736503 scopus 로고    scopus 로고
    • Sur le dimensionnement des structures en verre trempé
    • in French
    • BERNARD F., DAUDEVILLE L., GY R., Sur le dimensionnement des structures en verre trempé, Revue Française de Génie Civil, vol. 6, n°7-8, 2002, p. 1359-1380 (in French)
    • (2002) Revue Française de Génie Civil , vol.6 , Issue.7-8 , pp. 1359-1380
    • Bernard, F.1    Daudeville, L.2    Gy, R.3
  • 10
    • 3142682312 scopus 로고    scopus 로고
    • Creep and recovery of a thermally tempered glass plate at room temperature
    • Helsinki, 13-16 June
    • GY R., Creep and Recovery of a thermally tempered glass plate at room temperature, Glass Processing Days, Helsinki, 13-16 June 1999
    • (1999) Glass Processing Days
    • Gy, R.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.