Metal deposition on liquid crystal polymers for molded interconnect devices using physical vapor deposition

Journal of Adhesion Science and Technology

Volumn 18, Issue 8, 2004, Pages 883-891

  Wang, B ^a   Eberhardt, W ^a   Kuck H ^a  

^a Hahn Schickard Inst MT   (Germany)

Author keywords

Adhesion strength; Electroless plating; Liquid crystal polymer (LCP); Metallization; Molded interconnect devices (MIDs); Physical vapor deposition (PVD)

Indexed keywords

ADHESION; ELECTROLESS PLATING; ETCHING; METALLIZING; NICKEL; PHYSICAL VAPOR DEPOSITION; SUBSTRATES; SURFACE MOUNT TECHNOLOGY; THERMOPLASTICS; ULTRASONICS; BOND STRENGTH (MATERIALS); CHROMIUM; GOLD COATINGS; GOLD DEPOSITS; LIQUID CRYSTAL POLYMERS; PLASMA APPLICATIONS;

ADHESION STRENGTH; COHESIVE RUPTURES; METAL PLATINGS; MOLDED INTERCONNECT DEVICES (MID);

LIQUID CRYSTAL POLYMERS; METALS;

COPPER LAYER; ELECTROLESS PLATING OF NICKEL; METAL DEPOSITION; METAL LAYER; METAL SYSTEMS; METALLIZATION PROCESS; MOLDED INTERCONNECT DEVICES; PLASMA TREATMENT; THERMOPLASTIC MATERIALS;

EID: 3142734289     PISSN: 01694243     EISSN: None     Source Type: Journal    
DOI: 10.1163/156856104840480     Document Type: Article

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