Three dimensional finite element simulation of transient heat transfer in high efficiency deep grinding

CIRP Annals - Manufacturing Technology

Volumn 53, Issue 1, 2004, Pages 259-262

  Jin, T ^a   Stephenson, D J ^a  

^a CRANFIELD UNIVERSITY   (United Kingdom)

Author keywords

Finite element method; Grinding; Temperature

Indexed keywords

COMPUTER SIMULATION; FINITE ELEMENT METHOD; HEAT TRANSFER; MATHEMATICAL MODELS; MICROMACHINING; THERMAL EFFECTS;

CHIP ENERGY; HIGH EFFICIENCY DEEP GRINDING (HEDG); MELTING POINT;

GRINDING (COMMINUTION);

EID: 3142732889     PISSN: 00078506     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0007-8506(07)60693-3     Document Type: Article

References (13)

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