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Volumn 261-263, Issue II, 2004, Pages 1599-1604

Influence of the surface topography on the micromechanical properties and performance of a CMP finished AIN component for silicon plasma etching

Author keywords

AIN; CMP; Localized nanoindentation; Micro nanotribology; Seliconductor processing components; Surface damage; Surface topography

Indexed keywords

ATOMIC FORCE MICROSCOPY; CHEMICAL MECHANICAL POLISHING; CHEMICAL VAPOR DEPOSITION; DURABILITY; IN SITU PROCESSING; PLASMA ETCHING; SCANNING ELECTRON MICROSCOPY; SILICON WAFERS; SLURRIES; SURFACE PHENOMENA; SURFACE TOPOGRAPHY; TRIBOLOGY; VISCOELASTICITY; YTTRIUM;

EID: 3142680851     PISSN: 10139826     EISSN: 16629795     Source Type: Book Series    
DOI: None     Document Type: Conference Paper
Times cited : (7)

References (10)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.