300 mm automation: Perfection or dead end?

Semiconductor International

Volumn 25, Issue 8, 2002, Pages 143-152

  Heiland, Peter ^a   Whitcomb, Preston ^a   Thamm, Markus ^a   Tillmann, Ralf ^a  

^a Integrated Dynamics Enginering ^*  (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COST EFFECTIVENESS; DYNAMIC RANDOM ACCESS STORAGE; ELECTRONICS PACKAGING; FLEXIBLE MANUFACTURING SYSTEMS; INDUSTRIAL ENGINEERING; LITHOGRAPHY; MICROPROCESSOR CHIPS; PROCESS CONTROL; SEMICONDUCTOR MATERIALS; WSI CIRCUITS;

EQUIPMENT FRONT-END MODULE (EFEM); STANDARD MECHANICAL INTERFACE (SMIF) DESIGN; TOOL AUTOMATION; WAFER PROCESSING;

FACTORY AUTOMATION;

EID: 3142514705     PISSN: 01633767     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Review

References (2)

1. K. Mikkelsen and T. Niebeling, "Characterizing FOUPs and Evaluating Their Ability to Prevent Wafer Contamination," MICRO, March 2001.
2. P. Heiland, et al, "An Analysis of the Cost of Ownership (CoO) of Semiconductor Equipment," www.semiconducttor.net