Efficient 3-D extraction of interconnect capacitance considering floating metal fills with boundary element method

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

Volumn 25, Issue 1, 2006, Pages 12-18

  Yu, Wenjian ^a   Zhang, Mengsheng ^a   Wang, Zeyi ^a  

^a TSINGHUA UNIVERSITY   (China)

Author keywords

3D capacitance extraction; Area fill metals; Boundary element method; Boundary integral equation; Chemical mechanical polishing; Dielectric thickness; Floating dummy metals; Floating metal fills; Interconnect capacitance extraction; Signal delay

Indexed keywords

ALGORITHMS; BOUNDARY ELEMENT METHOD; CHEMICAL MECHANICAL POLISHING; COMPUTATION THEORY; CROSSTALK; DIELECTRIC MATERIALS; INTEGRAL EQUATIONS;

3D CAPACITANCE EXTRACTIONS; AREA FILL METALS; BOUNDARY INTEGRAL EQUATIONS (BIE); DIELECTRIC THICKNESS; FLOATING DUMMY METALS; FLOATING METAL FILLS; INTERCONNECT CAPACITANCE EXTRACTION; SIGNAL DELAY;

CAPACITANCE MEASUREMENT;

EID: 31344465996     PISSN: 02780070     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAD.2005.853690     Document Type: Article

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