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Volumn 25, Issue 1, 2006, Pages 12-18
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Efficient 3-D extraction of interconnect capacitance considering floating metal fills with boundary element method
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Author keywords
3D capacitance extraction; Area fill metals; Boundary element method; Boundary integral equation; Chemical mechanical polishing; Dielectric thickness; Floating dummy metals; Floating metal fills; Interconnect capacitance extraction; Signal delay
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Indexed keywords
ALGORITHMS;
BOUNDARY ELEMENT METHOD;
CHEMICAL MECHANICAL POLISHING;
COMPUTATION THEORY;
CROSSTALK;
DIELECTRIC MATERIALS;
INTEGRAL EQUATIONS;
3D CAPACITANCE EXTRACTIONS;
AREA FILL METALS;
BOUNDARY INTEGRAL EQUATIONS (BIE);
DIELECTRIC THICKNESS;
FLOATING DUMMY METALS;
FLOATING METAL FILLS;
INTERCONNECT CAPACITANCE EXTRACTION;
SIGNAL DELAY;
CAPACITANCE MEASUREMENT;
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EID: 31344465996
PISSN: 02780070
EISSN: None
Source Type: Journal
DOI: 10.1109/TCAD.2005.853690 Document Type: Article |
Times cited : (34)
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References (0)
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