Triple well applications profit from MeV implant technology

Semiconductor International

Volumn 21, Issue 4, 1998, Pages 71-72

  Borland, John Ogawa ^a  

^a AIXTRON Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 30844457943     PISSN: 01633767     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (12)

1. Economic Report, Korea, vol. 12, no. 7, July 1997.
2. Nikkei Micro Devices, special feature, Nov. 1993.
3. Jeff Honeycutt, Micron Semiconductor Inc., presentation at the Genus 2nd Annual MeV Implant Seminar, July 1994.
4. Seiichi Mori, Toshiba Corp., presentation at the Genus 1st Annual MeV Implant Seminar, July 1993.
5. Fujii, et al., IEEE Journal of Solid State Circuits, vol. 24, no. 5, Oct. 1989.
6. J.K. Kim, LG Semicon, presentation at the Genus 5th Annual MeV Implant seminar, July 1997.
7. S. Dash, et al., IBM Corp., 1991 VLSI Symposium, June 1991.
8. K. Tsukamoto, Mitsubishi, Electric Corp., presentation at the Genus 1st annual MeV implant seminar, July 1993.
9. Roberto Bez, ST, presentation at the Genus 3rd annual MeV implant seminar, July 1995.
10. J. Borland, Genus Inc., Semicon Southwest 96 technical digest on "Defect Engineering in Submicron Process Technologies," Oct. 1996.
11. J. Kawski, et al., "Cumulative Thin Film Stress and its Effect on Post Backgrind Wafer Shape," Semicon Singapore Technical Symposium, 1992
12. J. Borland, Genus Inc., presentation at the Genus 2nd Annual MeV implant seminar, July 1994.