Study on polishing profile at wafer edge by CMP using floating head

Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering

Volumn 66, Issue 9, 2000, Pages 1472-1476

  Shibaya, Hiroshi ^a   Kobayashi, Hiroyuki ^a  

^a NONE

Author keywords

Chemical mechanical polishing; Edge profile; Floating head; Non uniformity; Planarization; Pressure distribution; Retaining ring

Indexed keywords

EID: 30844452929     PISSN: 09120289     EISSN: None     Source Type: Journal    
DOI: 10.2493/jjspe.66.1472     Document Type: Article

References (7)

1. Y. Sisaki, H. Aoyama, I. Inasaki, H. Miyairi and H. Shibaya : Evaluation of Effective CMP Conditions by Estimation of Pressure Distribution on Semiconductor Wafer, Proc. ASPE Spring Top. Meet. Silicon Mach. 1998, (1998)92.
2. J. Yuan, D. Towery, J. Kajiwara, J. King, E. Kebra and K. Mogi : A Novel Wafer Carrier Ring Design Minimizes Edge Over-polishing Effects for Chemical Mechanical Polishing, Proc. VMIC Conf, June, (1995)525.
3. D. A. Hansen, G. Moloney, S. Luo and J. Y. Wu : Effect of Insert Compressibility on Oxide CMP, Proc. VMIC Conf, June, (1997)154.