Investigating the effects of diluting solutions and trace metal contamination on aggregation characteristics of silica-based ILD CMP slurries

Materials Research Society Symposium Proceedings

Volumn 867, Issue , 2005, Pages 159-164

  Denardis, D ^b,c   Choi, H ^a   Kim, A ^a   Moinpour, M ^a   Oehler, A ^a  

^a INTEL CORPORATION   (United States)

^b FMO/CGO Technical Intern   (United States)

^c UNIVERSITY OF ARIZONA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 30544450343     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-867-w7.9     Document Type: Conference Paper

References (8)

1. J. M. Steigerwald, S. P. Murarka and R. J. Gutmann: Chemical Mechanical Planarization of Microelectronic Materials (John Wiley & Sons, New York, 1997).
2. R. K. Iler: The Chemistry of Silica: Solubility, Polymerization, Colloid and Surface Properties, and Biochemistry (John Wiley & Sons, New York, 1979).
3. A. Y. Kim and J.C. Berg: Langmuir 16 (2000) 2101-2104.
4. J. L. Trompette and M. Meireles: J. Colloid Interface Sci. 262 (2003) 522-527.
5. J. Sonnefeld: Colloids and Surfaces. 190 (2001) 179-183.
6. M. R. Oliver (editor), D. Bonning, J. M. DeLarios, K. Devriendt, D. R. Evens, D. Hetherington, D. B. James, K. M. Robinson, D. J. Stein and T. Tucker: Chemical-Mechanical Planarization of Semiconductor Materials (Springer, Berlin, 2004).
7. A. Sorooshian, R. Ashwani, H. K. Choi, M. Moinpour, A. Oehler and A. Tregub, in Materials Research Society Symposium Proceedings Vol. 816: Advances in Chemical-Mechanical Polishing, D. Boning, J. Bartha, A. Philipossian, G. Shinn, I. Vos, Editors, p. 125, The Materials Research Society Symposium Proceedings, San Francisco, CA (2004).
8. N. P. Miller, J. C. Berg and R. W. O'Brien: J. Colloid Interface Sci. 153 (1992) 237.