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Volumn 865, Issue , 2005, Pages 423-429
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Effect of stresses in molybdenum back contact film on properties of CIGSS absorber layer
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Author keywords
[No Author keywords available]
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Indexed keywords
ADHESION;
COMPRESSIVE STRESS;
MAGNETRON SPUTTERING;
MICROSTRUCTURE;
STRESS ANALYSIS;
TENSILE STRESS;
DEPOSITION;
MOLYBDENUM;
MOLYBDENUM PLATING;
SUBSTRATES;
METALLIC PRECURSORS;
MOLYBDENUM BACK CONTACT;
SELENIZATION;
ABSORBER LAYERS;
DC MAGNETRON SPUTTERING;
DEPOSITION CONDITIONS;
DEPOSITION PARAMETERS;
EFFECT OF STRESS;
GLASS SUBSTRATES;
METALLIC PRECURSOR;
MOLYBDENUM FILMS;
MOLYBDENUM;
FILM PREPARATION;
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EID: 30544440826
PISSN: 02729172
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1557/proc-865-f14.13 Document Type: Conference Paper |
Times cited : (6)
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References (13)
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