Wideband electrical characterization of MCM materials

Electronic Packaging and Production

Volumn 36, Issue 7, 1996, Pages 47-54

  Riad, S ^a   Su, W ^a   Eishabini Riad, A ^a   Barlow, F ^a   Salama, I ^a  

^a VIRGINIA POLYTECHNIC INSTITUTE AND STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 3042942676     PISSN: 00134945     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (4)

1. S.M. Riad,A. Elshabini-Riad,W. Su, M.B. Hayes, and I.A. Bhutta," Wideband Electrical Characterization of LTCC Systems," 1994 Proceedings of the International Symposium on Microelectronics, pp. 312-317, 1994.
2. H. Tanaka, and F. Okada, et. al., "Precise Measurements of Dissipation Factor in Microwave Printed Circuit Boards," CPEM Digest, pp. 266-267, 1988.
3. S. Vasudevan and A. Shaikh, "Microwave Characterization of Low Temperature Co-Fired Ceramic Tape," Proceedings of the 1995 International Conference on Multichip Modules, pp. 164-174.
4. W. Su, S.M. Riad,A. Elshabini-Riad, and T. Poulin, "Crosstalk Analysis of Multisection Multiconductor Lines," IEEE Transactions on Instrumentation and Measurement, Vol. 41, No. 6, pp. 926-931, 1992.