An evaluation of an experimental glass frit free thick film metallization for ain-ceramics

Informacije MIDEM

Volumn 27, Issue 4, 1997, Pages 260-266

  Smetana, Walter ^a   Reicher, Roland ^a   Adlassnig, Alexander ^b   Schuster, Julius C ^b  

^a VIENNA UNIVERSITY OF TECHNOLOGY   (Austria)

^b UNIVERSITY OF VIENNA   (Austria)

Author keywords

AIN ceramics; Aluminum nitrides ceramics; Electrical conductive pastes; Metallization of AIN ceramic; Metallization pastes; Power electronics; Semiconductor devices; Semiconductors; Thick film metallization; Thick film pastes

Indexed keywords

EID: 3042896487     PISSN: 03529045     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Review

References (2)

1. A.H. Carim, R.E. Loehman, "Microstruclure of the AIN and Ag-Cu-Ti braze alloy", J. Matr. Res., 5, July 1990, 1520-1529.
2. A. Adlassnig, U.C. Schuster, R. Reicher, W. Smetana, "Synthesis of TiCuAg-Thick Film Inks for Glass Frit Free Metallization of Aluminium Nitride", Proceeding of the Workshop on Metal Ceramic Materials for Functional Applications and 3rd Workshop on Metal-Ceramic Composite Structures (Taiwan-Austrian Scientific Collaboration), June 1997, Vienna, 334-347.