Does anything pin the pitting behavior of aluminum?

Proceedings - Electrochemical Society

Volumn 23, Issue , 2003, Pages 1-11

  Wall, F D ^a   Martinez, M A ^a   Johnson, C M ^a   Harbour, J C ^a   Missert, N ^a   Copeland, R G ^a  

^a SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRODE MATERIALS; GERMINATION RATES; SECONDARY PHASE PARTICLES;

ALUMINUM; ALUMINUM ALLOYS; CHLORINE; ELECTRODES; GRAIN BOUNDARIES; ION IMPLANTATION; MORPHOLOGY; NUCLEATION; PITTING; PROBABILITY;

ELECTROCHEMISTRY;

EID: 3042841723     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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