Copper low-k contamination and post etch residues removal using supercritical CO2-based processes

Proceedings - Electrochemical Society

Volumn 26, Issue , 2003, Pages 271-278

  Millet, C ^a   Daviot, J ^b   Danel, A ^c   Perrut, V ^d   Tardif, F ^c   Broussous, L ^e   Renault, O ^c  

^a Altis Semiconductor   (France)

^b DUPONT COMPANY   (United States)

^c CEA GRENOBLE   (France)

^d RECIF SA   (France)

^e STMICROELECTRONICS   (France)

Author keywords

[No Author keywords available]

Indexed keywords

CARBON DIOXIDE; CONTAMINATION; ETCHING; OPTIMIZATION; OXIDATION; POROUS MATERIALS; SUPERCRITICAL FLUIDS;

CHELATING AGENTS; FLUID PRESSURE; POST ETCH RESIDUES;

SURFACE CLEANING;

EID: 3042826841     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

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