Surfactant enabled CO 2 cleaning processes for beol applications: Post barrier breakthrough

Proceedings - Electrochemical Society

Volumn 26, Issue , 2003, Pages 232-239

  Wagner, Mark ^a   DeYoung, James ^a   Gross, Steve ^a   Hatcher, Zach ^b   Ma, Ce ^c  

^a Micell Integrated Systems   (United States)

^b SEZ America   (United States)

^c BOC Edwards   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

IONIC SPECIES; POLAR MEDIA; WAFER CLEANING;

CARBON DIOXIDE; DIELECTRIC FILMS; DRYING; ELLIPSOMETRY; FOURIER TRANSFORM INFRARED SPECTROSCOPY; MICROEMULSIONS; POROUS MATERIALS; SURFACE ACTIVE AGENTS;

CLEANING;

EID: 3042819536     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

1. 2 Based Processes For Microelectronics," International Sematech Wafer Cleaning and Surface Prep Workshop, 2003, Proceedings TBD
2. 2 Cleaning Enables Sub-65 nm Processing," Semiconductor International, February 2003, p. 46.
3. K. McCullough, et al, "Supercritical Fluid Technology: From Lab Experiments to Full Wafer Processes," International Sematech Wafer Cleaning and Surface Prep Workshop, 2003, Proceedings TBD
4. 2," International Sematech Wafer Cleaning and Surface Prep Workshop, 2003, Proceedings TBD
5. 2/ Cosolvent Mixtures," International Sematech Wafer Cleaning and Surface Prep Workshop, 2003, Proceedings TBD
6. R. Reidy, et al, "Supercritical Processing of Porous MSQ Films," International Sematech Wafer Cleaning and Surface Prep Workshop, 2003, Proceedings TBD
7. G. J. McFann, Ph.D. Dissertation, University of Texas, Austin, TX, 1993.
8. T. A. Hoefling, et al, J. Phys. Chem. 95, 7127 (1991).