Microstructure and texture development in copper and aluminum under ecap: New experimental results and modeling

Ultrafine Grained Materials III

Volumn , Issue , 2004, Pages 247-253

  Estrin, Y ^a   Hellmig, R J ^a   Baik, S C ^b   Kim, H S ^c   Brokmeier, H G ^d   Zi, A ^a  

^a CLAUSTHAL UNIVERSITY OF TECHNOLOGY   (Germany)

^b POSCO   (South Korea)

^c Chungnam National University   (South Korea)

^d INSTITUTE OF MATERIALS RESEARCH   (Germany)

Author keywords

Aluminum; Constitutive modeling; Copper; ECAP; Mechanical properties; Texture

Indexed keywords

ALUMINUM; CRYSTAL STRUCTURE; DUCTILITY; GRAIN SIZE AND SHAPE; MATHEMATICAL MODELS; METAL PRESSING; MICROSTRUCTURE; MOLYBDENUM COMPOUNDS; PLASTICITY; TEXTURES; TRANSMISSION ELECTRON MICROSCOPY; VICKERS HARDNESS TESTING;

CONSTITUTIVE MODELING; EQUAL CHANNEL ANGULAR PRESSING (ECAP); GRAIN REFINEMENTS; ULTRA FINE GRAINS (UFG);

COPPER;

EID: 3042786371     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (13)

1. R.Z. Valiev, R.K. Islamgaliev, and I.V. Alexandrov, Progress Mater. Sci., 45 (2000) 103-189.
2. V.M. Segal, Mater. Sci. Eng., A197 (1995) 157-164.
3. Y. Iwahashi, J. Wang, Z. Horita, M. Nemoto, and T.G. Langdon, Scripta Mater., 35 ( 1996) 143-146.
4. A. Belyakov, T. Sakai, H. Miura, and K. Tsuzaki, Philos. Mag., A81 (2001) 2629-2643.
5. Y. Estrin, L.S. Tóth, A. Molinari, and Y. Bréchet, Acta mater., 46 (1998) 5509-5522.
6. S.C. Baik, Y. Estrin, H.S. Kim, and R.J. Hellmig, Mater. Sci. Eng., A351 (2003) 86-97.
7. S.C. Baik, R.J. Hellmig, Y. Estrin, and H.S. Kim, Z. Metallkd., 94 (2003) 754-760.
8. L.S. Tóth, A. Molinari, and Y. Estrin, J. Eng. Mater. Technol., 124 (2002) 71-77.
9. H.S. Kim, M.H. Seo, and S.I. Hong, Mater. Sci. Eng., A291 (2000) 86-90.
10. H.S. Kim, S.I. Hong, and M.H. Seo, J. Mater. Res., 16 (2001) 856-864.
11. S. Komura, Z. Horita, M. Nemoto, and T.G. Langdon, J. Mater. Res., 14 (1999) 4044-4050.
12. K. Neishi, Z. Horita, and T.G. Langdon, Mater. Sci. Eng., A325 (2002) 54-58.
13. S.C. Baik, Y. Estrin, R.J. Hellmig, and H.S. Kim, Proceedings of NanoSPD2 Conference held in Vienna, Dec. 2002, ed. M. Zehetbauer (Wiley-VCH, Weinheim, 2003).