Compensation of packaging asymmetry in a 2-D wind sensor

IEEE Sensors Journal

Volumn 3, Issue 6, 2003, Pages 761-765

  Matova, S P ^a   Makinwa, Kofi A A ^a   Huijsing, Johan H ^a  

^a DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

Electrothermal analogy; Nonideal packaging; Thermal asymmetry; Two dimensional (2 D) wind sensor

Indexed keywords

DIFFUSION; RESISTORS; SEMICONDUCTING ALUMINUM COMPOUNDS; SEMICONDUCTING SILICON; SENSORS; SIGNAL THEORY; THERMAL EFFECTS; WIND EFFECTS;

ELECTROTHERMAL ANALOGY; NONIDEAL PACKAGING; THERMAL ASYMMETRY; TWO-DIMENSIONAL (2-D) WIND SENSORS;

ELECTRONICS PACKAGING;

EID: 3042778688     PISSN: 1530437X     EISSN: None     Source Type: Journal    
DOI: 10.1109/JSEN.2003.820324     Document Type: Article

References (4)

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2. B. W. Van Oudheusden, "Silicon thermal flow sensor with a two-dimensional direction sensitivity," Meas. Sci. Technol., vol. 1, pp. 565-575, 1990.
3. S. P. Matova and J. H. Huijsing, "Three dimensional computer model of a smart wind sensor," in Proc. Sensors, 2001, pp. 834-838.
4. B. W. Van Oudheusden, "The thermal modeling of a flow sensor based on differential convective heat transfer," Sens. Actuators A, vol. 29, pp. 93-106, 1991.