Open circuit and galvanostatic behavior of copper oxidized and reduced in various solutions

Proceedings - Electrochemical Society

Volumn 26, Issue , 2003, Pages 421-426

  Hughes, Mike ^a   Naghshineh, Shahri ^a   Peters, Darryl ^a  

^a Surface Preparation Products Group   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL-MECHANICAL PLANARIZATION (CMP); COMPLEXING AGENTS; GALVANOSTATIC BEHAVIOR;

CHEMICAL CLEANING; CIRCUIT THEORY; COMPLEXATION; CONTAMINATION; CORROSION RESISTANCE; ELECTROCHEMISTRY; FUSED SILICA; HYDROPHOBICITY; OXIDATION; REDUCTION; SOLUTIONS;

COPPER COMPOUNDS;

EID: 3042742528     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (2)

1. McIntyre, et al, J. Vac. Sci. and Technol., 18(3), p. 714 (1981).
2. K. Bartosh, et al, this proceedings.