Bonding and contacting of MEMS-structures on wafer level

Proceedings - Electrochemical Society

Volumn 19, Issue , 2003, Pages 301-308

  Wiemer, M ^a   Fromel J ^a   Jia, C ^a   Gessner, T ^a,b  

^a FRAUNHOFER IZM   (Germany)

^b CHEMNITZ UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; CHEMICAL VAPOR DEPOSITION; ELECTRIC CONDUCTORS; ENCAPSULATION; MICROPROCESSOR CHIPS; POLYESTERS; SILICON WAFERS;

ELECTRICAL CONTACTING; SEAL GLASS BONDING; SQUEEGEE PRESSURES; SQUEEGEE VELOCITY;

MICROELECTROMECHANICAL DEVICES;

EID: 3042737312     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. M. Wiemer, T. Geßner, in Packaging and Interconnection Technology in Electronics, 6/2002, p. E98, Assembly and bonding technologies for wafer level integration, ISSN 0946-7777
2. N. Nguyen and E. Boellaard, J. Micromech. Microeng., 12, 395(2002).
3. C. Liu, in IEEE Instrumentation and Measurement Technology Conference/1998, St.Paul, Minnesoda,(1998)
4. R. Markunas, P. Enquist, T. Connolly, in Packaging of MEMS & Related micro integrated nano Systems, September 6-8, 2002, Denver, Colorado, MEMS Integrated into mainstream IC Processes
5. A. Zincke, Technologie der Glasschmelze, Technisch physikalische Monographien, Leipzig 1961, akademische Verlagsgesellschaft Geest & Portig K.-G.