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Volumn 26, Issue , 2003, Pages 279-288

Water removal and repair of porous ultra low-k films using supercritical CO 2

Author keywords

[No Author keywords available]

Indexed keywords

COSOLVENTS; ETCHING DAMAGE; PLASMA ASHING;

EID: 3042703031     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (7)

References (29)
  • 15
    • 33646227073 scopus 로고    scopus 로고
    • E6.10, Mats., Tech., & Reliability for Adv. Interconnects and Low-k Dielectrics, Editors: A. McKerrow, J. Leu, O. Kraft, T. Kikkawa
    • R. Reidy, Z. Zhang, R. A. Orozco-Teran, B. P. Gorman, and D. W. Mueller, MRS Proceedings, Vol 766, E6.10, Mats., Tech., & Reliability for Adv. Interconnects and Low-k Dielectrics, Editors: A. McKerrow, J. Leu, O. Kraft, T. Kikkawa (2003).
    • (2003) MRS Proceedings , vol.766
    • Reidy, R.1    Zhang, Z.2    Orozco-Teran, R.A.3    Gorman, B.P.4    Mueller, D.W.5
  • 25
    • 33646210063 scopus 로고    scopus 로고
    • E8.20, Materials, Technology, and Reliability for Advanced Interconnects and Low-k Dielectrics, Editors: A. McKerrow, J. Leu, O. Kraft, T. Kikkawa
    • R. A. Orozco-Teran, B. P. Gorman, Z. Zhang, D. W. Mueller, and R. F. Reidy, MRS Proceedings,Vol 766, E8.20, Materials, Technology, and Reliability for Advanced Interconnects and Low-k Dielectrics, Editors: A. McKerrow, J. Leu, O. Kraft, T. Kikkawa (2003).
    • (2003) MRS Proceedings , vol.766
    • Orozco-Teran, R.A.1    Gorman, B.P.2    Zhang, Z.3    Mueller, D.W.4    Reidy, R.F.5


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.