Low carbon contamination and water mark free post-CMP cleaning of hydrophobic osg dielectrics

Proceedings - Electrochemical Society

Volumn 26, Issue , 2003, Pages 305-311

  Bartosh, Kyle ^a   Brown, Erik ^a   Naghshineh, Shahri ^a   Peters, Darryl ^a   Walker, Elizabeth ^a  

^a Surface Preparation Products Group   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL-MECHANICAL-PLANARIZATION (CMP); LIGHT POINT DEFECTS (LPD); ORGANIC CONTAMINATES; ORGANOSILICATE GLASSES (OSG);

DECOMPOSITION; DELAMINATION; DIELECTRIC MATERIALS; HYDROPHOBICITY; MATHEMATICAL MODELS; OPTIMIZATION; SOLUTIONS; SURFACE ACTIVE AGENTS; THERMAL CYCLING; WETTING;

ELECTROCHEMISTRY;

EID: 3042700120     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. K. Bartosh, Y. Li, K. Cheemalapti, R. Chowdhury, M. Hughes, and D. Peters, Surface Preparation Chemistries for CMP and Post CMP Applications, CAMP Conference, 2003.
2. S. MacKinnon, Proc. Microcontamination, 94, p. 174 (1994).
3. M. Wantanabe, et al, Materials Science and Engineering, B4, p. 401 (1989).