Thermal modeling of the ISIS H- ion source

Review of Scientific Instruments

Volumn 75, Issue 5 PART II, 2004, Pages 1738-1740

  Faircloth, D C ^a   Thomason, J W G ^a   Lau, W ^b   Yang, S ^b  

^a RUTHERFORD APPLETON LABORATORY   (United Kingdom)

^b UNIVERSITY OF OXFORD   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; COMPUTATIONAL FLUID DYNAMICS; COMPUTER SIMULATION; COOLING SYSTEMS; FINITE ELEMENT METHOD; HEAT TRANSFER COEFFICIENTS; NUSSELT NUMBER; PARTICLE ACCELERATORS; PLASMA SOURCES; PROTONS; THERMAL CONDUCTIVITY; THERMAL EFFECTS; THERMOCOUPLES;

CERAMIC INSULATORS; CONTACT RESISTANCE; ELECTRODE SURFACES; TRANSIENT THERMAL MODELING;

ION SOURCES;

EID: 3042520768     PISSN: 00346748     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1695615     Document Type: Conference Paper

References (4)

1. R. Sidlow et al., Proceedings EPAC 96, 1996, THP084L.
2. ALGOR Inc., 150 Beta Drive, Pittsburgh, PA 15238-2932 〈www.algor.com〉
3. ANSYS Inc., Southpointe, 275 Technology Dr., Canonsburg, PA 15317 〈www.ansys.com/cfx〉
4. J. D. Sherman et al., Proceedings EPAC 2002, THALA002.