Investigation of dissolution and electrodeposition of copper in concentrated and diluted oxalic acid media in post-CMP cleaning

Solid State Phenomena

Volumn 103-104, Issue , 2005, Pages 287-290

  Gabrielli, C ^a   Mace, C ^b   Matha, J ^b   Mege S ^b   Ostermann, E ^a,b   Perrot, H ^a  

^a Université Pierre et Marie Curie   (France)

^b Altis Semiconductor   (France)

Author keywords

Copper; Dendritic growth; Dissolution; Electrodeposition; Impedance; Oxalic acid

Indexed keywords

COPPER; COPPER COMPOUNDS; DISSOLUTION; ELECTRIC IMPEDANCE; ELECTRODEPOSITION; ELECTRODES; MICROELECTRONICS;

ANODIC POTENTIALS; CRITICAL CONDITION; DAMASCENE PROCESS; DENDRITIC GROWTH; ELECTROCHEMICAL MECHANISMS; IMPEDANCE MEASUREMENT; MICROELECTRONIC INDUSTRY; POST-CMP CLEANING;

OXALIC ACID;

EID: 30344436534     PISSN: 10120394     EISSN: 16629779     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/SSP.103-104.287     Document Type: Conference Paper

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