Silicon-based thermal comfort sensing device

Sensors and Actuators, A: Physical

Volumn 54, Issue 1-3, 1996, Pages 468-471

  Bu, Jong Uk ^a   Kim, Tae Yoon ^a   Kim, In Sik ^a   Jun, Young Sam ^a   Shim, Young Cho ^a   Kim, Sung Tae ^a  

^a LG Electronics Inc   (South Korea)

Author keywords

PMV indicators; Predicted mean vote (PMV); Thermal comfort; Thermal comfort sensing; Thermal environment

Indexed keywords

EID: 30244559674     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(97)80005-2     Document Type: Article

References (4)

1. P.O. Fanger, Thermal Comfort, McGraw-Hill, New York, 1973, p. 244.
2. B.W. Olesen, Thermal comfort, Tech. Rev. No. 2, Brüel and Kjær Co., Denmark, 1982, pp. 8-9.
3. A.P. Gagge, Am. Soc. Heating Refrig. Airconditioning Eng. Trans., 77 (1971) 241.
4. ISO 7730, Moderate Thermal Environments - Determination of the PMV and PPD Indices and Specification of the Conditions for Thermal Comfort, International Standards Organization, Geneva, Switzerland, 1984.