Electroless plating of thin silver films on porous Al2O3 substrate and the study of deposition kinetics

Tsinghua Science and Technology

Volumn 10, Issue 6, 2005, Pages 680-689

  Mei, Fang ^a   Shi, Donglu ^a  

^a UNIVERSITY OF CINCINNATI   (United States)

Author keywords

Deposition kinetics; Electroless plating; Thin silver films

Indexed keywords

ALUMINA; BOND STRENGTH (MATERIALS); COATING TECHNIQUES; COMPUTER SIMULATION; ELECTRIC CONDUCTIVITY OF SOLIDS; ELECTRODEPOSITION; MATHEMATICAL MODELS; POROUS MATERIALS; SCANNING ELECTRON MICROSCOPY; SILVER PLATING; SINTERING; THIN FILMS; X RAY DIFFRACTION ANALYSIS;

COATED COMPOSITE; COATING KINETICS; DEPOSITION KINETICS; FILM BONDING STRENGTH; INNER PORE SURFACES; RETICULATED ALUMINA; SILVER DEPOSITION; THIN SILVER FILMS;

ELECTROLESS PLATING;

EID: 30044448304     PISSN: 10070214     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1007-0214(05)70136-X     Document Type: Article

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