Component obsolescence risk assessment

IIE Annual Conference and Exhibition 2004

Volumn , Issue , 2004, Pages 2373-2378

  Josias, Craig ^a   Terpenny, Janis P ^a   McLean, Kenneth J ^b  

^a University of Massachusetts Amherst   (United States)

^b Kollmorgen Electro Optical   (United States)

Author keywords

Commercial off the shelf (COTS); Diminishing manufacturing sources and material shortages (DMSMS); Obsolescence; Risk management; Sustainability

Indexed keywords

COMMERCIAL OFF THE SHELF (COTS); DIMINISHING MANUFACTURING SOURCES AND MATERIAL SHORTAGES (DMSMS); HIGH-TECH COMPONENTS; SUSTAINABILITY;

CUSTOMER SATISFACTION; MACHINE COMPONENTS; MATHEMATICAL MODELS; MOTION CONTROL; OBSOLESCENCE; PRODUCT DEVELOPMENT; REGRESSION ANALYSIS; RISK MANAGEMENT;

RISK ASSESSMENT;

EID: 30044445651     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

1. th joint FAA/DoD/NASA Aging Aircraft Conference, Sept 16-19, 2002, pp. 1-13
2. Stogdill, C. R., Wright-Patterson Air Force Base, "Dealing with Obsolete Parts" IEEE Design & Test of Computers, April-June 1999
3. Livington, Henry, "GEB1 : Diminishing Manufacturing Sources and Material Shortages (DMSMS) Management Practices," (Government Electronics & Information Technology Association G-12 Solid State Devices Committee.
4. Merrill, J., "Looking Ahead - A short history of Submarine Periscopes", 2002
5. "Obsolescence Management Plan - Virginia Class Tech Refresh IPT", May 2003, Revised Oct. 2003
6. Pecht, M., Sandborn, P., Solomon, R., Wilkinson, Chris., Das, D., "Life Cycle Forecasting, Mitigation Assessment and Obsolescence Strategies" CALCE EPSC Press, 2000.
7. Scott Mueler, "Upgrading and repairing PCs" 2003
8. "How Microprocessors Work" http://www.howstuffworks.com/ microprocessor1.htm
9. th Joint FAA/DoD/NASA Aging Aircraft Conference, Sept. 16-19, 2002
10. Dasgupta, A., Magrab, E., Anand, D., Eisenger, K., McLeish, J., Torres, M., Lall, T., Dishongh, T., "Perspectives to understanding risks in the Electronic Industry" IEEE Transactions on Component, Packaging, and Manufacturing Technology - Part A, vol. 20, no. 4, December 1997.