Experimental study of thickness effects on evaporation/boiling on thin sintered copper mesh surfaces

Proceedings of the ASME Summer Heat Transfer Conference

Volumn 1, Issue , 2005, Pages 281-290

  Li, Chen ^a   Peterson, G P ^a   Wang, Yaxiong ^b  

^a RENSSELAER POLYTECHNIC INSTITUTE   (United States)

^b Foxconn Thermal Technology Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER-MESH; THERMAL CONTACTS; THICKNESS EFFECTS; WICK LAYER;

ATMOSPHERIC PRESSURE; BOILING LIQUIDS; COATINGS; COPPER; EVAPORATION; SINTERING; THICKNESS MEASUREMENT;

SURFACE PHENOMENA;

EID: 29744456900     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/HT2005-72431     Document Type: Conference Paper

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