A liquid cooler module with carbon foam for electronics cooling applications

AIAA Paper

Volumn , Issue , 2004, Pages 1216-1223

  Cao, Yiding ^a   Ponnappan, Rengasamy ^b  

^a The Department of Electrical and Computer Engineering   (United States)

^b AIR FORCE RESEARCH LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CARBON; COOLANTS; COOLING; MASS TRANSFER; POROUS MATERIALS; THERMAL CONDUCTIVITY;

CARBON FOAMS; THERMAL DISPERSION EFFECTS;

FOAMS;

EID: 2942733330     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.2514/6.2004-492     Document Type: Conference Paper

References (6)

1. Hunt, M.L. and Tien, C.L., 1988a, "Effects of Thermal 'Dispersion on the Forced Convection in Porous Media," Int. J. Heat Mass Transfer, Vol. 31.
2. th National Heat Transfer Conference, July 24-28, Houston, Texas.
3. Hwang, G.J. and Chao, C.H., 1994, "Heat Transfer Measurement and Analysis for Sintered Porous Channels," ASME J. Heat Transfer, Vol. 116, pp.456-464.
4. Klett, James, 1988, "High Thermal Conductivity Pitch-Based Carbon Foams for Thermal Management", Technical Report, Oak Ridge National Lab.
5. th AIAA Aerospace Sciences Meeting & Exhibit, January 14-17, Reno, NV.
6. Lee, K. and Howell, J.R., 1991, "Theoretical and Experimental Heat and Mass Transfer in Highly Porous Media," Int. J. Heat Mass Transfer, Vol. 34, No. 8, pp. 2123-2132.