Brazing silicon nitride to an iron-based intermetallic using a copper interlayer

Ceramics International

Volumn 30, Issue 6, 2004, Pages 901-910

  Brochu, M ^a   Pugh, M D ^b   Drew, R A L ^a  

^a MCGILL UNIVERSITY   (Canada)

^b Gina Cody School of Engineering and Computer Science   (Canada)

Author keywords

Brazing; Cu interlayer; D. Si3N4; FA 129; Residual stress

Indexed keywords

ACTIVATION ENERGY; BRAZING; COPPER; CORROSION RESISTANCE; DIFFERENTIAL SCANNING CALORIMETRY; INTERMETALLICS; RESIDUAL STRESSES; SCANNING ELECTRON MICROSCOPY;

FA-129; INTERLAYERS; SI3N4;

SILICON NITRIDE;

EID: 2942717242     PISSN: 02728842     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ceramint.2003.10.011     Document Type: Article

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