Surface morphology and residual stress of electroplated and electroless copper deposits

Computational and Experimental Methods

Volumn 6, Issue , 2001, Pages 285-299

  Keong, K G ^a   Sha, W ^a   Guo, Z X ^b   Malinov, S ^a  

^a QUEEN'S UNIVERSITY BELFAST   (United Kingdom)

^b QUEEN MARY UNIVERSITY OF LONDON   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

CLADDING (COATING); ELECTROLESS PLATING; MORPHOLOGY; OPTICAL MICROSCOPY; RESIDUAL STRESSES; SCANNING ELECTRON MICROSCOPY; STAINLESS STEEL; X RAY DIFFRACTION;

DIELECTRIC SUBSTRATES; GRANULAR PARTICLES; LAMINATED POLYMERS; VOIDS SCATTERING;

COPPER;

EID: 2942692150     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (15)

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