Localized, in-situ vacuum measurements for MEMS packaging

Materials Research Society Symposium - Proceedings

Volumn 782, Issue , 2003, Pages 211-215

  Moelders, Nicholas ^a   Daly, James T ^a   Greenwald, Anton C ^a   Johnson, Edward A ^a   McNeal, Mark P ^a   Patel, Ramesh ^a   Pralle, Martin U ^a   Puscasu, Irina ^a  

^a Ion Optics Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP CARRIERS; HERMETIC PACKAGING; VACUUM MEASUREMENTS;

CRYSTALS; LIGHT REFLECTION; OPTIMIZATION; PACKAGING; PHOTONS; SEMICONDUCTOR DEVICES; SILICON; VACUUM;

MICROELECTROMECHANICAL DEVICES;

EID: 2942675109     PISSN: 02729172     EISSN: None     Source Type: Journal    
DOI: 10.1557/proc-782-a5.32     Document Type: Article

References (5)

1. Nicholas Moelders, et. al., "Designing Thermally Uniform MEMS Hot Micro-Bolometers" MRS Symp. Proc. v.729, paper U5.2
2. R. P. Manginell, "Polycrystalline-Silicon Microbridge Combustible Gas Sensor", Ph.D. Thesis, University of new Mexico, Albuquerque, 1997.
3. From Sandia National Laboratory web site, microelectronics division, 2000.
4. NIST microhotplate, U.S. Patent 5,464,966
5. K. Gilleo and S. Corbett, Circuit Assembly, p26, (January, 2001).