Electro-chemical mechanical polishing of copper and chemical mechanical polishing of glass

Journal of Materials Processing Technology

Volumn 149, Issue 1-3, 2004, Pages 493-498

  Venkatesh, V C ^a   Izman, S ^a   Mahadevan, S C ^a  

^a UNIVERSITI TEKNOLOGI MALAYSIA   (Malaysia)

Author keywords

Chemical mechanical polishing; Interlevel dielectric; Ultralarge scale integrated circuits

Indexed keywords

COPPER; ELECTROCHEMISTRY; GLASS; INFRARED RADIATION; INTEGRATED CIRCUITS; LASER OPTICS; LOGARITHMIC AMPLIFIERS; POLYCRYSTALLINE MATERIALS; SILICON COMPOUNDS; WSI CIRCUITS;

INTERLEVEL DIELECTRIC; ISOLATION TRENCHES; ULTRALARGE SCALE INTEGRATED CIRCUITS; WAFER TECHNOLOGY;

CHEMICAL MECHANICAL POLISHING;

EID: 2942610708     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jmatprotec.2003.11.056     Document Type: Conference Paper

References (11)

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