Measurement and analysis of effective thermal conductivities of lotus-type porous copper

Journal of Applied Physics

Volumn 95, Issue 10, 2004, Pages 5843-5847

  Ogushi, T ^a   Chiba, H ^a   Nakajima, H ^b   Ikeda, T ^b  

^a MITSUBISHI ELECTRIC CORPORATION   (Japan)

^b OSAKA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY CONDITIONS; COOLING; HEAT LOSSES; HEAT SINKS; HEAT TRANSFER; HEATING; LAPLACE TRANSFORMS; PORE SIZE; POROUS MATERIALS; SET THEORY; SILICON WAFERS; THERMAL CONDUCTIVITY; THERMAL EFFECTS;

HEAT FLOW; MICROCHANNELS; SEMICONDUCTOR CHIPS;

COPPER;

EID: 2942577936     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1691188     Document Type: Article

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