Micro-fabrication of crystalline silicon by controlled alkali etching

Journal of Materials Processing Technology

Volumn 149, Issue 1-3, 2004, Pages 567-572

  Fulong, Yuan ^a   Yongfeng, Guo ^a   Yingchun, Liang ^a   Yongda, Yan ^a   Honggang, Fu ^b   Kai, Cheng ^a   Xichun, Luo ^a  

^a HARBIN INSTITUTE OF TECHNOLOGY   (China)

^b HEILONGJIANG UNIVERSITY   (China)

Author keywords

Alkaline; Atomic force microscopy; Crystalline silicon; Etching; Micro protuberances

Indexed keywords

ATOMIC FORCE MICROSCOPY; CRYSTAL STRUCTURE; CRYSTALLIZATION; DIFFUSION; ETCHING; HYDRAZINE; MICROSTRUCTURE; REDOX REACTIONS; SILICON WAFERS; SINGLE CRYSTALS;

ALKALINE; CRYSTALLINE SILICON; DIFFUSION RATE; MICRO-PROTUBERANCES;

SILICA;

EID: 2942572929     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jmatprotec.2003.10.060     Document Type: Conference Paper

References (11)

1. Langa W. Silicon microstructuring technology. Mater. Sci. Eng. R: Rep. 17(1):1996;1-55.
2. Zubel I., Barycka I. Silicon anisotropic etching in alkaline solutions. I. The geometric description of figures developed under etching Si(1. 0 0) in various solutions Sens. Actuators A. 70:1998;250-259.
3. Zubel I. Silicon anisotropic etching in alkaline solutions. II. On the influence of anisotropy on the smoothness of etched surfaces. Sens. Actuators A. 70:1998;260-268.
4. Zubel I. Silicon anisotropic etching in alkaline solutions. III. On the possibility of spatial structures forming in the course of Si(1. 0 0) anisotropic etching in KOH and ( KOH+IPA solutions Sens. Actuators A. 84:2000;116-125.
5. Zubel I., Barycka I., Kotowska K., Kramkowska M. Silicon anisotropic etching in alkaline solutions. IV. The effect of organic and inorganic agents on silicon anisotropic etching process. Sens. Actuators A. 87:2001;163-171.
6. Sato K., Shikida M., Matsushima Y., Yamashiro T., Asaumi K., Iriye Y., Yamamoto M. Characterization of orientation-dependent etching properties of single-crystal silicon: effect of KOH concentration. Sens. Actuators A: Phys. 64:1998;87-93.
7. Seidel H., Csepregi L., Heuberger A., Baumgärtel H. Anisotropic etching of crystalline silicon in alkaline solutions. J. Electrochem. Soc. 137:1990;3612-3626.
8. Gosálvez M.A., Foster A.S., Nieminen R.M. Atomistic simulations of surface coverage effects in anisotropic wet etching of crystalline silicon. Appl. Surf. Sci. 202:2002;160-182.
9. Zubel I., Kramkowska M. The effect of alcohol additives on etching characteristics in KOH solutions. Sens. Actuators A. 101:2002;255-261.
10. Liyi C., Noboru M., Kiwamu A. Micro-fabrication of single crystal silicon by using combination technique of nano-scale machining and alkaline etching. Jpn. Soc. Precis. Eng. 67(9):2001;1453-1457.
11. Liyi C., Noboru M., Kiwamu A. Maskless pattern formation which used alkaline etching and nano-scale cutting by using friction force microscope. Jpn. Soc. Precis. Eng. 66(11):2000;1807-1811.