A reliable molding technique by using epoxy-based resin for thin-film superconducting quantum interference devices

IEEE Transactions on Applied Superconductivity

Volumn 15, Issue 4, 2005, Pages 3901-3905

  Kawai, Jun ^a,b,d,e   Sakamoto, Yushi ^a,c   Kawabata, Miki ^a,b   Shimozu, Tatsuyuki ^a,b,d   Uehara, Gen ^a,b,d   Ogata, Hisanao ^b,f  

^a IEEE   (Japan)

^b KANAZAWA INSTITUTE OF TECHNOLOGY   (Japan)

^c Sumitomo Bakelite Co Ltd ^*  (Japan)

^d JAPAN SOCIETY OF APPLIED PHYSICS   (Japan)

^e National Laboratory for High Energy Physics   (Japan)

^f Cryogenic Society of   (Japan)

Author keywords

Epoxy resin; Package; Superconducting quantum interference device (SQUID); Wirebond

Indexed keywords

NIOBIUM WIREBONDS; PACKAGE; STABLE PACKAGE; WIREBOND;

ALUMINUM; NIOBIUM ALLOYS; SQUIDS; THERMAL CONDUCTIVITY; THERMAL CYCLING; THIN FILMS;

EPOXY RESINS;

EID: 29344448036     PISSN: 10518223     EISSN: None     Source Type: Journal    
DOI: 10.1109/TASC.2005.859043     Document Type: Article

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