Size effects on the mechanical properties of thin metallic films studied by nanoindentation

8th Korea-Russia International Symposium on Science and Technology - Proceedings: KORUS 2004

Volumn 3, Issue , 2005, Pages 168-172

  Shugurov, Artur ^a,b   Panin, Alexey ^a,c   Chun, Hui Gon ^d   Oskomov, Konstantin ^e  

^a INSTITUTE OF STRENGTH PHYSICS AND MATERIALS SCIENCE   (Russian Federation)

^b TOMSK STATE UNIVERSITY   (Russian Federation)

^c NATIONAL RESEARCH TOMSK POLYTECHNIC UNIVERSITY   (Russian Federation)

^d University of Ulsan   (South Korea)

^e INSTITUTE OF HIGH CURRENT ELECTRONICS   (Russian Federation)

Author keywords

Copper; Mechanical properties; Nanoindentation; Silver; Strengthening; Substrate effects; Thin films

Indexed keywords

COPPER; GRAIN SIZE AND SHAPE; HARDNESS; INDENTATION; MECHANICAL PROPERTIES; POLYCRYSTALLINE MATERIALS; SILICON; SILVER; SURFACE ROUGHNESS; THIN FILMS;

NANOINDENTATION; STRENGTHENING; SUBSTRATE EFFECTS;

METALLIC FILMS;

EID: 29144509851     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

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8. Suresh S., Nieh T.-G., Choi B.W. Nanoindentation of Copper Thin Films on Silicon Substrates, Scripta Mater. 1999, v. 41, n.9. p.951-957.