Nonlinear vibration of a one-degree of freedom shape memory alloy oscillator: A numerical-experimental investigation

Collection of Technical Papers - AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics and Materials Conference

Volumn 6, Issue , 2005, Pages 3937-3954

  Lagoudas, Dimitris C ^a   Machado, Luciano G ^a   Lagoudas, Magdalini ^a  

^a TEXAS A AND M UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ATTENUATION VIBRATIONS; DAMPING DEVICES; PSEUDOELASTIC RESPONSE; RESTORING FORCES;

ATTENUATION; COMPUTER SIMULATION; DAMPING; DEGREES OF FREEDOM (MECHANICS); FREQUENCY RESPONSE; MATHEMATICAL MODELS; OSCILLATORS (MECHANICAL); SHAPE MEMORY EFFECT; STRAIN; VIBRATION CONTROL; VIBRATIONS (MECHANICAL);

VIBRATION MEASUREMENT;

EID: 28844507236     PISSN: 02734508     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (16)

1. Saadat, S., Salich, J., Noori, M., Hou, Z., Davoodi, H., Baron, I., Suzuki, Y., and Masuda, A., "An Overview of Vibration and Seismic Applications of NiTi Shape Memory Alloy", Smart Materials and Structures, Vol. 11, 2002, pp. 218,229.
2. Salich, J., Hou, Z., and Noori, M., "Vibration Suppression of Structures Using Passive Shape Memory Alloy Energy Dissipation Devices". Journal of Intelligent Material Systems and Structures, Vol. 12, 2001, pp. 671, 680.
3. Lexcellent, C. and Boubon, G, "Thermiodynamical model of cyclic behavior of Ti-Ni and Cu-Zn-Al shape memory alloys under isothermal undulated tensile tests, Mechanics of Materials, Vol. 24, 1996, pp,59,73
4. Brinson, L. C., "One-dimensional constitutive behavior of shape memory alloys: Thermomechanical derivation with nonconstant material functions and redefined martensite internal variables"
5. Bartera, F., and Giacchetti, R., "Steel dissipating braces for upgrading existing buildings frames", Journal of Constructional Steel Research, Vol. 60, 2004, pp. 751, 769.
6. Khan, M. M., Lagoudas, D. C., Mayes, J. J., Henderson, B. K., "Pseudoelastic SMA Wire Elements for Passive Vibration Isolation, Part I: Modeling", Journal of Intelligent Material Systems and Structures, Vol. 15, No. 6, 2004, pp. 415, 441.
7. Khan, M. M., Lagoudas, D. C., Mayes, J. J., Henderson, B. K., "Pseudoelastic SMA Wire Elements for Passive Vibration Isolation, Part II: Simulations and Experimental Correlations", Journal of Intelligent Material Systems and Structures, Vol. 15, No. 6, 2004, pp. 443, 470.
8. Lacarbonara, W., Bernardini, D., and Vestroni, F., "Nonlinear Thermomechanical Oscillations of Shape-Memory Devices", International Journal of Solid and Structures, Vol.41, 2004, pp. 1209, 1234.
9. Ivshin, Y., and Pence, T. J., "A Thermodynamical Model for One-Variant Shape Memory Alloy Material", Journal of Intelligent Material Systems and Structures, Vol. 5, 1994, pp. 455, 473.
10. Machado, L. G., and Lagoudas, D. C., "Dynamical Response of Shape Memory Alloys", Proceeding of IMECE: 2004 ASME International Mechanical Engineering Congress, November 13-19, 2004. Anaheim, California, USA.
11. Qidwai, M. A., and Lagoudas, D. C., "Numerical Implementation of a Shape Memory Alloy Thermomechanical Constitutive Model Using Return Mapping Algorithm", International Journal for Numerical Methods in Engineering, Vol. 47, 2000, pp.1123, 1168.
12. Boyd, J. G., and Lagoudas, D. C., "A Thermodynamical Constitutive Model for Shape Memory Materials. Part I. The Monolithic Shape Memory Alloy", International Journal of Plasticity, Vol. 12, No. 6, 1996, pp. 805, 842.
13. Lagoudas, D. C., Bo, Z., and Qidwai, M., "A Unified Thermodynamic Constitutive Model for SMA and Finite Element Analysis of Active Metal Matrix Composites", Mechanics of Composite Materials and Structures, Vol. 3, 1996, pp.153,179.
14. Simo, J. C., and Hughes, T. C., Computational Inelasticity, Springer-Verlag, New York, 1997, Chap. 3.
15. Bathe, K.-Y., Finite Element Procedures, Prentice-Hall, 1996, New Jersey, Chap. 9.
16. Dimarogonas, A.D., and Haddad, S., Vibration for Engineers, Prentice Hall, New Jersey, 1992, Chap. 3.