Advanced CMP technology and applications

Proceedings - Electrochemical Society

Volumn 11, Issue , 2004, Pages 235-243

  Zwicker, Gerfried ^a  

^a FRAUNHOFER INSTITUTE FOR SILICON TECHNOLOGY ISIT   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; CONTROLLABILITY; INTEGRATED CIRCUITS; MICROELECTROMECHANICAL DEVICES; MICROELECTRONICS; SLURRIES;

CMP SLURRY; CMP TOOLS;

CHEMICAL MECHANICAL POLISHING;

EID: 28844466063     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)

1. International Technology Roadmap for Semiconductors, 2003 Edition
2. M. Markworth et al., Proc. CMP-MIC 2004, p. 509
3. G. Moersch, Proc. CMP-MIC 2004, p. 489
4. K. Cheemalapati et al. Proc., CMP-MIC 2004, p. 23
5. G. Zwicker et al., Proc. CMP-MIC, p. 216
6. W. Lortz et al., MRS Proc. Vol. 767, 2003
7. H. Yano et al., ECS Proc. Vol. 2002-1, p. 71
8. S.B. Samavedam et al., Proc. IEDM 2003, 13.1
9. J. Kedzierski et al., Proc. IEDM 2003, 13.3
10. J. Lee et al. Proc. IEDM 2003, 13.6
11. S. Lai, Proc. IEDM 2003, 10.1
12. P. Lefevre et al., Proc. CMP-MIC 2004, p. 433