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Volumn 410-411, Issue , 2005, Pages 53-57
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Creep behavior of extruded Al-6Mg-1Sc-1Zr-10 vol.% SiCp composite
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Author keywords
Aluminum matrix composite; Creep behavior; Threshold stress
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Indexed keywords
ACTIVATION ENERGY;
CREEP TESTING;
LOW TEMPERATURE EFFECTS;
METAL EXTRUSION;
METALLIC MATRIX COMPOSITES;
METALLOGRAPHIC MICROSTRUCTURE;
SCANNING ELECTRON MICROSCOPY;
SOLID SOLUTIONS;
STRESSES;
TENSILE PROPERTIES;
TRANSMISSION ELECTRON MICROSCOPY;
YIELD STRESS;
ALUMINUM MATRIX COMPOSITE;
APPARENT ACTIVATION ENERGY;
APPARENT STRESS;
CREEP BEHAVIOR;
SOLID SOLUTION ALLOYS;
THRESHOLD STRESS;
ALUMINUM ALLOYS;
CREEP;
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EID: 28844465816
PISSN: 09215093
EISSN: None
Source Type: Journal
DOI: 10.1016/j.msea.2005.08.096 Document Type: Article |
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Times cited : (12)
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References (19)
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