Thermal stability and creep of polycrystalline nanowires

Acta Materialia

Volumn 54, Issue 2, 2006, Pages 305-311

  Klinger, Leonid ^a   Rabkin, Eugen ^a  

^a TECHNION ISRAEL INSTITUTE OF TECHNOLOGY   (Israel)

Author keywords

Creep; Grain boundary diffusion; Nanowires; Surface diffusion

Indexed keywords

CREEP; GRAIN BOUNDARIES; MICROSTRUCTURE; MORPHOLOGY; NANOSTRUCTURED MATERIALS; THERMODYNAMIC STABILITY;

NANOWIRES; SURFACE DIFFUSION;

POLYCRYSTALLINE MATERIALS;

EID: 28844461654     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2005.08.034     Document Type: Article

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