Stress-induced void formation in passivated Cu films

Materials Research Society Symposium Proceedings

Volumn 863, Issue , 2005, Pages 259-264

  Gan, Dongwen ^a   Li, Bin ^a   Ho, Paul S ^a  

^a UNIVERSITY OF TEXAS AT AUSTIN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; ANISOTROPY; MATHEMATICAL MODELS; PASSIVATION; THIN FILMS;

ISOTHERMAL ANNEALING; THRESHOLD STRESS; VOID FORMATION;

COPPER;

EID: 28844459635     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-863-b7.8/o11.8     Document Type: Conference Paper

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