Pore structure and integration performance of a porous CVD ultra low k dielectric

Materials Research Society Symposium Proceedings

Volumn 863, Issue , 2005, Pages 41-47

  Liu, Youfan ^a   Knorr, Andreas ^b   Wu, Wen Li ^c   Gidley, David ^d   Kastenmeier, Bernd ^e  

^a INTEL CORPORATION   (United States)

^b SEMATECH   (United States)

^c NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

^d UNIVERSITY OF MICHIGAN   (United States)

^e IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL VAPOR DEPOSITION; POROUS MATERIALS;

ELECTRICAL CHARACTERISTICS; MATERIAL STRUCTURE; PORE STRUCTURE;

DIELECTRIC MATERIALS;

EID: 28844456532     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-863-b3.1     Document Type: Conference Paper

References (3)

1. Wen-li Wu, et al, 2003 SEMATECH low k workshop, and references therein.
2. David W. Gidley, et al. 2003 SEMATECH low k workshop, and references therein.
3. Youfan Liu, et. al. Proceedings of AMC 2003, p.531 -536