NIL - A low-cost and high-throughput MEMS fabrication method compatible with IC manufacturing technology

Microelectronics Journal

Volumn 37, Issue 2, 2006, Pages 121-126

  Fan, Xiqiu ^a   Zhang, Honghai ^a   Liu, Sheng ^a,b   Hu, Xiaofeng ^a   Jia, Ke ^a  

^a HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

^b Wayne State University   (United States)

Author keywords

Alignment; MEMS; Nanoimprint lithography (NIL); Technological compatibility

Indexed keywords

ALIGNMENT; INTEGRATED CIRCUITS; LITHOGRAPHY; NANOSTRUCTURED MATERIALS; NANOTECHNOLOGY; THREE DIMENSIONAL; THROUGHPUT;

3D STRUCTURE; MEMS; NANOIMPRINT LITHOGRAPHY (NIL); TECHNOLOGICAL COMPATIBILITY;

MICROELECTROMECHANICAL DEVICES;

EID: 28644446052     PISSN: 00262692     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mejo.2005.04.047     Document Type: Article

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