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Volumn 24, Issue 17, 2005, Pages 1837-1854

Development of a characterization mold to measure the transverse thermal conductivity of a composite material by inverse analysis

Author keywords

Inverse analysis; Mold design; Transverse thermal conductivity

Indexed keywords

BOUNDARY CONDITIONS; COMPOSITE MATERIALS; COMPUTER SIMULATION; HEAT CONDUCTION; RESIN TRANSFER MOLDING; SURFACE TENSION;

EID: 28444486614     PISSN: 07316844     EISSN: None     Source Type: Journal    
DOI: 10.1177/0731684405052808     Document Type: Article
Times cited : (11)

References (18)
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.