RF characterization and modeling of various wire bond transitions

IEEE Transactions on Advanced Packaging

Volumn 28, Issue 4, 2005, Pages 772-778

  Lim, JuHwan ^a   Kwon, DaeHan ^b   Rieh, Jae Sung ^a   Kim, Soo Won ^a   Hwang, SungWoo ^a  

^a Korea University   (South Korea)

^b Hynix Semiconductor Inc   (South Korea)

Author keywords

Conductor backed CPW; Coplanar waveguide (CPW); Electromagnetic simulation; Finite ground CPW; Microstrip; Modes; Wire bond

Indexed keywords

COMPUTER SIMULATION; ELECTRIC CONDUCTORS; ELECTRIC IMPEDANCE; EQUIVALENT CIRCUITS; SEMICONDUCTING SILICON; WAVEGUIDES;

CONDUCTOR BACKED CPW; ELECTROMAGNETIC SIMULATION; FINITE GROUND CPW; WIRE BOND TRANSITIONS;

ELECTRONICS PACKAGING;

EID: 28444471640     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2005.853554     Document Type: Article

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