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Volumn II, Issue , 2005, Pages 840-845

Rapid generation of thermal-safe test schedules

Author keywords

[No Author keywords available]

Indexed keywords

LOCAL OVERHEATING; MAXIMUM POWER CONSTRAINT; POWER CONSTRAINED SYSTEM-LEVEL; THERMAL AWARENESS;

EID: 28444467069     PISSN: 15301591     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/DATE.2005.252     Document Type: Conference Paper
Times cited : (39)

References (13)
  • 1
    • 0033683901 scopus 로고    scopus 로고
    • Design of system-on-a-chip test access architectures under place-and-route and power constraints
    • K. Chakrabarty. Design of system-on-a-chip test access architectures under place-and-route and power constraints. In Proc. IEEE/ACM Design Automation Conference (DAC), pages 432-437, 2000.
    • (2000) Proc. IEEE/ACM Design Automation Conference (DAC) , pp. 432-437
    • Chakrabarty, K.1
  • 4
    • 0034995151 scopus 로고    scopus 로고
    • Precedence-based, preemptive, and power-constrained test scheduling for system-on-a-chip
    • V. Iyengar and K.Chakrabarty. Precedence-based, preemptive, and power-constrained test scheduling for system-on-a-chip. In VLSI Test Symposium (VTS), pages 368-374, 2001.
    • (2001) VLSI Test Symposium (VTS) , pp. 368-374
    • Iyengar, V.1    Chakrabarty, K.2
  • 9
    • 0033901706 scopus 로고    scopus 로고
    • Simultaneous module selection and scheduling for power-constrained testing of core based systems
    • C. Ravikumar, G. Chandra, and A. Verma. Simultaneous module selection and scheduling for power-constrained testing of core based systems. In 13th International Conference on VLSI Design, pages 462-467, 2000.
    • (2000) 13th International Conference on VLSI Design , pp. 462-467
    • Ravikumar, C.1    Chandra, G.2    Verma, A.3
  • 11
    • 79952470095 scopus 로고    scopus 로고
    • How power aware test improves reliability and yield
    • September 15
    • C. Shi and R. Kapur. How power aware test improves reliability and yield. In EEDesign.com. September 15 2004.
    • (2004) EEDesign.com
    • Shi, C.1    Kapur, R.2
  • 13
    • 0032003411 scopus 로고    scopus 로고
    • ATPG for heat dissipation minimization during test application
    • February
    • S. Wang and S. Gupta. ATPG for heat dissipation minimization during test application. IEEE Transactions on Computers, 47(2):256-262, February 1998.
    • (1998) IEEE Transactions on Computers , vol.47 , Issue.2 , pp. 256-262
    • Wang, S.1    Gupta, S.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.