Joint exploration of architectural and physical design spaces with thermal consideration

Proceedings of the International Symposium on Low Power Electronics and Design

Volumn , Issue , 2005, Pages 123-126

  Wu, Yen Wei ^a   Yang, Chia Lin ^a   Yuh, Ping Hung ^a   Chang, Yao Wen ^a  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

Author keywords

Architectural Floorplanning; Performance; Thermal

Indexed keywords

COMPUTER ARCHITECTURE; PRODUCT DESIGN; TEMPERATURE DISTRIBUTION; THERMOANALYSIS;

ARCHITECTURAL FLOORPLANNING; DESIGN SPACES; FRAMEWORK; THERMAL;

MICROPROCESSOR CHIPS;

EID: 28444445319     PISSN: 15334678     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1145/1077603.1077636     Document Type: Conference Paper

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