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Volumn 2, Issue 2, 1996, Pages 50-55

The effect of residual solvent on the profiles of thick positive DNO-photoresist for microsystem technologies

Author keywords

[No Author keywords available]

Indexed keywords


EID: 2842609195     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF02447750     Document Type: Article
Times cited : (4)

References (20)
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    • Huang JP; Kwei TK; Reiser A (1989) On the Dissolution of Novolak in Aqueous Alkali. Macromolecules 22: 4106
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    • Optische Lithographie als Strukturierungsmethode der Mikrotechnik und spezielle Anwendungen für den LIGA-Prozess. 1
    • Kernforschungszentrum Karlsruhe KfK
    • Schulz J; Mohr J (1993) Optische Lithographie als Strukturierungsmethode der Mikrotechnik und spezielle Anwendungen für den LIGA-Prozess. 1. Statuskolloquium des Projektes Mikrosystemtechnik, Kernforschungszentrum Karlsruhe KfK 5238: 127
    • (1993) Statuskolloquium des Projektes Mikrosystemtechnik , vol.5238 , pp. 127
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    • Some Relative Merits of Contact, Near-Contact and Projection Printing
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    • Dissolution Kinetics of a Positive Photoresist: The Secondary Structure Model
    • Templeton MK, Szmanda CR; Zampini A (1987) Dissolution Kinetics of a Positive Photoresist: The Secondary Structure Model. Proc. SPIE 771: 136
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    • A Percolation View of Novolak Dissolution. 2. The Statistics of Three-Dimensional Cubic Percolation Field and a Generalized Scaling Law
    • Yeh TF; Reiser A; Dammel RR; Pawlowski G; Roeschert H (1993) A Percolation View of Novolak Dissolution. 2. The Statistics of Three-Dimensional Cubic Percolation Field and a Generalized Scaling Law. Macromolecules 26: 3862
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.