Bonding kinetics of thermosetting adhesive systems used in wood-based composites: The combined effect of temperature and moisture content

Journal of Adhesion Science and Technology

Volumn 3, Issue 1, 1989, Pages 397-413

  Humphrey, Philip E ^a   Ren, Shan ^a  

^a OREGON STATE UNIVERSITY   (United States)

Author keywords

Bond strength development; Moisture content; Powdered phenolic adhesive; Temperature; Thermosetting adhesives; Wood based composites

Indexed keywords

EID: 2842539939     PISSN: 01694243     EISSN: 15685616     Source Type: Journal    
DOI: 10.1163/156856189X00290     Document Type: Article

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