Test and driving circuits for a novel 3D interconnect technology;Eine Test- und Ansteuerschaltung für eine neuartige 3D Verbindungstechnologie

Advances in Radio Science

Volumn 3, Issue , 2005, Pages 305-310

  Bschorr, M ^a   Pfleiderer, H J ^a   Benkart, P ^a   Kaiser, A ^a   Munding, A ^a   Kohn, E ^a   Heittmann, A ^b   Hubner H ^b   Ramacher, U ^b  

^a UNIVERSITY OF ULM   (Germany)

^b INFINEON TECHNOLOGIES AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 28344450426     PISSN: 16849965     EISSN: 16849973     Source Type: Journal    
DOI: 10.5194/ars-3-305-2005     Document Type: Article

References (5)

1. Abramovici, M., Breuer, M. A., and Friedman, A. D.: Digital Systems Testing and Testable Design. IEEE Press, New "York, 19090.
2. Heittmann, A., Ramacher, U., Matolin, D., Schreiter, J., and Schuff-ny, R.: An Analog VLSI Pulsed Neural Network for Image Segmentation Using Adaptive Connection Weights. ICANN 2002 Proceedings, Madrid, Spain, 2415, 1293-1298, 2002
3. HubnerT IT., Eiener, M., Gruber, W., Klurmpp, A., Merkel, R., Ramm, P., Roth, M., Weber, J., and Wieland, R.: Face-to-Face Chip Integration with Full Metal Interface. Proc. Advanced Metallization Conference AMC 2002, 53, 2002.
4. Munding, A., Kaiser, A., Benkart, P., Bschorr, M., Heittmann, A., Hubner, H., Pfleiderer, H.-J., Ramacher, U., and Kohn, E.: Chip Stackine Technology for 3D-Integration of Sensor Systems. HE-TECH 22004, 13th European workshop on heterostructure technology, October 2004, Heraklion, Greece, 2004.
5. Schreiter, J., Ramacher, U., Heittmann, A., Matolin, D., and Schuff-ny, R.: Cellular Pulse Coupled Neural Network with Adaptive-Weights for Image Segmentation and its VLSI Implementation. SPIE, San Jose (CA), USA, 5298, 290-296, 2004.